DFM Review, Rework & X-Ray Inspection

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Expert Rework, X-Ray Inspection & Design Optimization

Maxtech Electronics offers comprehensive rework, inspection, and design support services to help you get your product right - whether you're bringing a new design to production or recovering boards that need repair. Our rework capabilities handle virtually any placement or rework challenge, from the most demanding fine-pitch QFP parts and SMT headers to complex BGA and leadless devices. Most rework projects are completed in 1-5 days depending on your specific requirements.

BGA, QFP, fine-pitch SMT, and leadless component rework
X-ray inspection for BGA, leadless, and microBGA devices
BGA reballing services
DFM review to optimize your design before production
Fast turnaround - most projects completed in 1-5 days

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What We Do

Rework, Inspection & DFM Services

The expertise and equipment to recover, verify, and optimize your electronic assemblies.

BGA & Leadless Rework

Our rework system can place or rework any Ball Grid Array (BGA) or leadless component with precision temperature profiling to protect surrounding components.

X-Ray Inspection

X-ray is the only reliable way to verify solder joint integrity on BGAs and leadless devices. Our high-power X-ray machine inspects BGAs, QFNs, leadless devices, and microBGAs with detailed imaging.

Fine-Pitch SMT Rework

Precision rework of fine-pitch QFP components, SMT headers, and small passive components using calibrated hot-air and soldering equipment.

BGA Reballing

Complete BGA reballing services to restore or replace solder balls on BGA packages, extending component life and recovering assemblies for reuse.

DFM Review

Our engineers review your Gerber files, BOM, and design data before production to identify potential manufacturability issues - saving time, cost, and yield loss before a single board is built.

Voiding Analysis

X-ray inspection to detect and quantify solder voiding in BGA and leadless packages, with reporting against industry standards for pass/fail determination.

Design for Manufacturability

Optimize Your Design Before It Hits the Production Floor

Design for Manufacturability (DFM) review is one of the highest-value services Maxtech offers. Our engineers analyze your PCB layout, BOM, and assembly requirements against real-world manufacturing constraints - identifying issues that could cause production delays, assembly defects, or higher costs before a single board is built.

A DFM review typically takes 1-2 business days and can prevent far more costly problems downstream. We provide a clear written report with specific recommendations you can act on before releasing your design to production.

Component spacing and courtyard violations
Pad geometry and solder mask recommendations
BOM review for component availability and alternates
Panelization and fiducial placement
Testability and ICT access recommendations

Background

Why Rework & X-Ray Inspection Matter

As PCB assemblies become denser and components get smaller, visual inspection alone is no longer sufficient to verify assembly quality. BGA and leadless packages have solder joints that are completely hidden beneath the component body - the only way to verify joint integrity, detect shorts, or observe voiding is with X-ray imaging.

Similarly, rework on modern assemblies requires more than a soldering iron. BGA reballing, fine-pitch QFP removal, and leadless component replacement demand calibrated equipment, controlled thermal profiles, and experienced technicians. Attempting these operations without the right tools risks further damage to your board and surrounding components.

When You Need X-Ray Inspection

BGA, QFN, and LGA solder joint verification
Voiding analysis on thermal pads
Suspected shorts or opens under leadless devices
First article inspection on new designs
Incoming inspection on purchased assemblies

When You Need Rework

Wrong component placed or damaged in assembly
ECO (Engineering Change Order) updates to existing builds
BGA solder joint failures detected by X-ray
Component obsolescence requiring substitution
Field returns requiring board-level repair